The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2000
Filed:
Jul. 21, 1998
Applicant:
Inventors:
Yinon Degani, Highland Park, NJ (US);
Robert Charles Frye, Piscataway, NJ (US);
Yee Leng Low, Berkeley Heights, NJ (US);
Assignee:
Lucent Technologies Inc., Murray Hill, NJ (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361761 ; 361764 ; 361748 ; 361803 ; 257723 ;
Abstract
The specification describes a recessed chip IC package in which the cavity in the printed wiring board into which the IC chip is recessed is used as a through hole interconnection, thus increasing the interconnection density. If the through cavity interconnections are used as power and ground the signal I/O pads and the signal runners are effectively isolated.