The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2000

Filed:

Jan. 08, 1999
Applicant:
Inventor:

Eric D Wagganer, Milpitas, CA (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438618 ; 438424 ; 438314 ; 438968 ; 438622 ; 257330 ;
Abstract

An improved method of forming a metallization layer in a layer stack is disclosed. In one aspect of the invention, a method of performing a lithographic damascene etch on a layer stack to form a metal line is disclosed. The layer stack, which is disposed above a substrate, is comprised of an underlying layer. The method of performing the lithographic damascene etch comprises the steps of depositing a photoresist layer above the layer stack and forming a trench in the photoresist layer so that the trench is positioned over the underlying layer of the layer stack. The method continues with depositing a metal layer over the top surface of the photoresist layer and filling the trench, planarizing the metal layer down to about a level of the top surface of the photoresist layer to define a top surface of a metal line, and removing the photoresist layer to leave gaps around the metal line. A dielectric material is then deposited to fill the gaps around the metal line up to a level of about the top surface of the metal line.


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