The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2000
Filed:
Nov. 20, 1998
Shozo Katamachi, Mitaka, JP;
Shinji Shibaoka, Mitaka, JP;
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Abstract
A work piece such as a semiconductor ingot is positioned and bonded to a work piece bonding block by a bonding jig which is provided separately from a wire saw in such a manner that the central axis of the work piece and respective horizontal and vertical surfaces of the work piece bonding block come into parallel to each other. Then, the work piece bonding block is positioned and mounted at a mounting jig which is provided on a cutting-feeding table of the wire saw and which has horizontal and vertical reference surfaces perpendicularly intersecting a cutting plane, so that the central axis of the work piece automatically and perpendicularly intersects the cutting plane. Then, the mounting jig is tilted to tilt the work piece by a tilting mechanism in such a manner that the central axis is inclined against the cutting plane at a predetermined angle on the basis of shift value data of the crystal orientation with the central axis of the work piece a reference, which has previously been measured outside the wire saw.