The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2000
Filed:
Jun. 11, 1998
Applicant:
Inventors:
John A Adams, Escondido, CA (US);
Gerald A Krulik, San Clemente, CA (US);
Everett D Smith, Escondido, CA (US);
Assignee:
SpeedFam IPEC Corp., Chandler, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ;
U.S. Cl.
CPC ...
205 87 ; 205123 ; 205147 ;
Abstract
Simultaneous non-contact plating and planarizing of copper interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
Quick Actions:
Adams, John. (2000). Method for simultaneous non-contact electrochemical plating and (U.S. Patent No. 6143155). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6143155
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile