The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2000

Filed:

Sep. 22, 1999
Applicant:
Inventors:

Chee Klang Yew, Woodlands, SG;

Siu Waf Low, Lengkok Angsa, SG;

Min Yu Chan, Braddell Hill, SG;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257686 ; 257737 ; 257738 ; 257774 ; 257778 ; 257723 ; 257724 ; 257780 ; 361760 ; 361767 ; 361770 ; 361771 ;
Abstract

A thin, stacked face-to-face integrated circuit packaging structure includes a chips attached to both major surfaces of a rigid interposer, and interconnected by printed wiring traces and vias to external solder ball contacts attached to the interposer.


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