The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Apr. 25, 1996
NEC Corporation, Tokyo, JP;
Abstract
The present invention provides a semiconductor wafer tester including a substrate, at least one chip mounted on an upper surface of the substrate, the chip having function as a tester, the chip being electrically connected to a contact formed on a lower surface of the substrate through an internal wiring formed in the substrate, and a contact film having at least one first bump formed on an upper surface thereof and at least one second bump formed on a lower surface thereof, the first bump being electrically connected to the second bump through an internal wiring formed throughout the contact film, the contact film being to be disposed to be sandwiched between the substrate and a semiconductor wafer to be tested so that the first bump is in electrical contact with the contact of the substrate and the second bump is in electrical contact with the semiconductor wafer. The tester makes it possible to carry out high frequency test concurrently for a plurality of semiconductor wafers in a shorter period of time with lower costs.