The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 17, 2000

Filed:

Jan. 27, 1998
Applicant:
Inventors:

Yaw S Obeng, Orlando, FL (US);

Robert L Opila, Scotch Plains, NJ (US);

Ramaswamy S Raghavan, Berkeley Heights, NJ (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438745 ; 438754 ; 216 87 ; 216100 ;
Abstract

The present invention provides a method for removing contaminant metals from a solvent used in the manufacture of a semiconductor wafer. The method may comprise the steps of bringing a solvent having contaminant metals therein into contact with a sacrificial body having titanium oxide associated therewith and cleaning the semiconductor wafer with the solvent. The titanium oxide reacts with the contaminant metals to substantially remove them from the solvent to provide a substantially cleaner solvent for the production of metal oxide semiconductor (MOS)devices. The present invention is particularly applicable in 'back-end' processes of such devices.


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