The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Dec. 02, 1997
Applicant:
Inventor:
Behrooz Mehr, Palo Alto, CA (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
438612 ; 438613 ; 257773 ; 361772 ;
Abstract
A ball grid array integrated circuit package which has a plurality of elliptical shaped solder pads located on a substrate of the package. Routing traces are connected to the apexes of the elliptical shaped solder pads. Connecting a routing trace to the apex of an elliptical shaped solder pad reduces the stress points on the trace/pad interface. Vias may be coupled to the solder pads and the routing traces. The vias are located at the apexes of the elliptical shaped solder pads to reduce the stress points of the substrate.