The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Feb. 20, 1998
Masaru Ichihara, Kadoma, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A measurement window 29 is set in a bump formation position found from the bump formation co-ordinates of bonding data in respect of an image that has been picked up of the external appearance of a stud bump 23 at an inspection position. The image in this measurement window 29 is converted to respective binary images based on binary conversion levels which are respectively individually set for measurement of bump pedestal 24 and for bump head 27. Of image grains constituted by continuous areas of the same image level in the binary image, an image grain having maximum area is extracted and the position, shape and dimensions of the bump pedestal 24 and bump head 27 are then respectively measured using respectively a hole-filled image and the hole portion of this extracted image grain. The quality and presence of a stud bump 23 are determined by comparing the measured values with set values.