The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2000

Filed:

Sep. 21, 1999
Applicant:
Inventors:

Jeffrey R Watson, Phoenix, AZ (US);

Kiet M Van, Chandler, AZ (US);

Steven B Roach, Gilbert, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; F27B / ; F27D / ; F27D / ;
U.S. Cl.
CPC ...
228 22 ; 2281801 ; 228118 ; 228214 ; 228 19 ; 228 21 ; 432-4 ; 432 13 ; 432 34 ; 432 50 ; 432226 ; 4322541 ; 219393 ; 21945212 ;
Abstract

The invention provides a reflow furnace for an electronic assembly. The electronic assembly comprises a printed circuit board and a device on the printed circuit board. The printed circuit board has solder at a first area near the device and a metallic surface at second area distant from the device. The furnace comprises a frame, a support, a heater, and a shield. The support is secured to the frame and is capable of holding the printed circuit board. The heater is secured to the frame and is capable of heating the printed circuit board while being held by the support. The shield is secured to the frame and is positioned to prevent solder from migrating from the first area to the metallic surface at the second area while the printed circuit board is being heated.


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