The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2000
Filed:
Jul. 24, 1996
Applicant:
Inventors:
Masahiro Ichitani, Koganei, JP;
Ryo Haruta, Kodaira, JP;
Katsuyuki Matsumoto, Hitachi, JP;
Arata Kinjyo, Tachikawa, JP;
Tsutomu Kakimoto, Komoro, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437108 ; 438112 ; 438123 ; 438126 ; 438108 ;
Abstract
In the BGA in which the bonding portions of the support frame bonded to the wiring substrate via adhesive layer are molded by a resin, the areas of the bonding portions are each selected to be from 0.5 to 3.1 mm.sup.2. Furthermore, holes are formed in the substrate under the frame corresponding to the bonding portions.
Ichitani, Masahiro. (2000). Semiconductor device and method of manufacturing the same (U.S. Patent No. 6120301). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6120301
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile