The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2000
Filed:
Apr. 02, 1998
Applicant:
Inventors:
Kuniyuki Takahashi, Musashimurayama, JP;
Hijiri Hayashi, Nakano-Ku, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23Q / ; B23Q / ;
U.S. Cl.
CPC ...
228102 ; 228-45 ; 228-9 ; 2281805 ;
Abstract
A bonding apparatus for manufacturing, for instance, a semiconductor device including a computer system which calculates a limit value of a driving current that flows to a linear motor controlling a bonding arm, and the computer system including a memory which stores correction current values that are used to correct the driving force of a plate spring at various height positions of the bonding arm, and limit values of the driving current according to a bonding load.
Takahashi, Kuniyuki. (2000). Wire bonding apparatus and bonding load correction method for the same (U.S. Patent No. 6119917). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6119917
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile