The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2000
Filed:
May. 04, 1999
Applicant:
Inventors:
Krishna Gandhi Sachdev, Hopewell Junction, NY (US);
Michael Berger, Gardiner, NY (US);
Anson Jay Call, Poughkeepsie, NY (US);
Frank Louis Pompeo Jr, Walden, NY (US);
Assignee:
International Business Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K / ; C08L / ; C08L / ; C08L / ;
U.S. Cl.
CPC ...
525118 ; 523458 ; 524440 ; 525486 ; 525504 ;
Abstract
An adhesive for bonding a die of an integrated circuit chip comprises an aryl cyanate (ester) resin and/or a diepoxide resin admixed with tetrahydropyranyl-protected hydroxylmethylated phenolic resin or hydroxymethylated poly(hydroxystyrene) optionally further containing an electrically or thermally conductive filler.
Sachdev, Krishna. (2000). Aryl cyanate and/or diepoxide and tetrahydropyranyl-protected (U.S. Patent No. 6114450). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6114450
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile