The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2000
Filed:
Aug. 26, 1998
No-Hyun Huh, Yongin-shi, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A method of forming contacts of a semiconductor device while improving a step coverage and increasing margins between the device and an adjacent device. The novel method comprises the steps of forming an interlayer insulating film. A contact hole is formed in the interlayer insulating film. A mask layer is deposited over the contact hole to a thickness sufficient to withstand the planarization process and is planarization-etched. Wet-etching is performed over the entire semiconductor substrate, thereby etching the interlayer insulating film, wherein the wet-etching is characterized in that exposed portions of the interlayer insulating film outside of the contact hole and interfacing the mask layer are etched faster than other upper exposed portions of the interlayer insulating film. As a result, the contact hole has a sloped-sidewalls profile. With this sloped profile of the contact sidewalls, the step coverage of the metal line can be improved and the horizontal margins for isolating devices is increased, thus improving the degree of integration.