The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2000
Filed:
Mar. 02, 1998
Osamu Myohga, Tokyo, JP;
Shiro Yoshida, Tokyo, JP;
Mitsuo Saito, Tokyo, JP;
Yuzo Shimada, Tokyo, JP;
Hirokazu Tohya, Tokyo, JP;
Ryo Maniwa, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A laminate printed circuit board loaded with transistors, ICs (Integrated Circuits) or LSIs (Large Scale Integrated Circuits) and a method of producing the same are disclosed. The circuit board includes a signal layer, a ground layer and a power supply layer sequentially laminated with the intermediary of insulation layers. An impedance adding circuit is formed in the power supply layer. A magnetic layer is positioned at least above or at least blow the impedance adding circuit. The circuit board with this configuration reduces power supply noise to a noticeable degree.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile