Apparatus and method for cleaning semiconductor wafer

Abstract

A method and apparatus for cleaning a semiconductor wafer. The apparatus preferably includes a brush holder that may include a base and a connection stud extending from the base. The base preferably includes a receiving lip for receiving a brush that is disposed on its lower surface. The brush preferably includes a substantially flexible material and a plurality of protrusions for contacting a semiconductor wafer. A backing plate preferably is attached to one side of the brush for connecting the brush to the brush holder. The backing plate preferably further includes an outer edge capable of forming a snap-fit engagement within the receiving lip of the brush holder to: (a) facilitate periodic replacement of the brush and (b) form a mechanical connection between the brush and brush holder that can withstand the presence of relatively basic or acidic cleaning agents. A rotatable shaft is connected to the connection stud. The rotatable shaft includes a conduit running through the shaft for flowing cleaning fluid through a borehole in the connection stud and brush holder and through an opening in the backing plate and brush so that cleaning fluid may be directly dispensed through the shaft conduit to the wafer. This cleaning fluid disbursement technique improves cleaning and prevents particles from being left behind as the brush is removed from the wafer.