The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 22, 2000

Filed:

Jul. 07, 1998
Applicant:
Inventors:

Hao-Kuang Chiu, Hsinchu, TW;

Peng-Yih Peng, Hsinchu Hsien, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B01D / ;
U.S. Cl.
CPC ...
21032163 ; 451446 ; 451 60 ; 210415 ; 366274 ;
Abstract

A chemical-mechanical polishing (CMP) apparatus includes a filtering apparatus for filtering slurry. The filtering apparatus includes an input aperture located at the top of the filter housing and connected to a slurry supplying machine. An output aperture located at the side of the filter housing is connected to a polishing pad. The filtering apparatus also includes a filter attached to the top of the filter housing and a stirring objected located below the filter. A stirrer is located below the filter housing for driving the stirring object without a mechanical contact. The stirring object is preferably bar-shaped and enclosed with PTFE.


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