The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 15, 2000

Filed:

Jan. 21, 1999
Applicant:
Inventors:

Masayoshi Hirose, Yokohama, JP;

Yoshimi Sasaki, Atsugi, JP;

Akira Ogata, Yokohama, JP;

Seiji Ishikawa, Yokohama, JP;

Tamami Takahashi, Yamato, JP;

Hirokuni Hiyama, Tokyo, JP;

Yutaka Wada, Yokohama, JP;

Assignee:

Ebara Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
451287 ; 451288 ; 451495 ; 451527 ;
Abstract

A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.


Find Patent Forward Citations

Loading…