The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2000
Filed:
Aug. 19, 1998
Chang-Ming Lu, Taoyuan Hsien, TW;
Shu-Ying Lu, Hsinchu Hsien, TW;
United Integrated Circuits Corp., Hsinchu, TW;
Abstract
The invention provides a structure of a bonding pad, which comprising: a substrate; a dielectric layer formed over the substrate; a first metal layer formed in the dielectric layer; a second metal layer formed in the dielectric layer and above the first metal layer; a plurality of first plugs formed between the first metal layer and the second metal layer, wherein the plugs are used for connecting the first metal layer with the second metal layer; a third metal layer formed over the dielectric layer; and a plurality of second plugs, formed between the second metal layer and the third metal layer, wherein the second plugs are used for connecting the second metal layer with the third metal layer.