The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2000

Filed:

Dec. 17, 1997
Applicant:
Inventors:

Thean Loy Yap, Singapore, SG;

Boon Hee Wee, Singapore, SG;

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
29 2501 ; 29593 ; 414627 ; 414737 ; 438 14 ; 438 18 ; 324760 ; 294 641 ;
Abstract

A design for a picker nest which protects any fragile component, such as a bare IC die, mounted on an IC package when the picker nest is holding the IC package for testing. The picker nest of the present invention includes a picker nest head having a picker nest opening with a vacuum suction. The fragile component fits within the picker nest opening as the picker nest is holding the IC package such that no contact force is exerted on the fragile component. The picker nest of the present invention also includes a conductive seal surrounding the perimeter of the picker nest opening for sealing in the vacuum suction within the picker nest opening. The conductive seal is a silicon-based sponge for effectively sealing in the vacuum suction at various temperatures. At least one supporting bar disposed on the picker nest head exerts a force against the IC package substrate toward test contacts of the testing system during testing of the IC package to ensure proper contact of the IC package pins to the test contacts. The conductive seal, the at least one supporting bar, and the picker nest head are comprised of a conductive material to further ensure ESD (Electro Static Discharge) protection for the IC package during testing.


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