The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2000
Filed:
Jun. 28, 1999
Pei-Wei Tsai, Chu-Pei, TW;
Huan-Jen Tseng, Chu-Pei, TW;
Chih-Hsien Chang, Taipei Hsien, TW;
Yi-Hua Chin, Taipei, TW;
Mosel Vitelic Inc., Hsin-Chu, TW;
Abstract
The present invention provides a control device for maintaining a chemical mechanical polishing (CMP) machine in a wet mode, the CMP machine comprising a polishing pad, a slurry sprinkler for sprinkling liquid or deionized water, and at least one carrier head, the control device comprising a sensor positioned on the CMP machine for sensing the operational status of the slurry sprinkler and generating a corresponding sensing signal; and a control unit electrically connected to the sensor for measuring the time period over which the slurry sprinkler is closed wherein when the measured time period exceeds a predetermined length, the control unit will either send a warning signal or turn on the slurry sprinkler to sprinkle liquid onto the polishing pad according to a predetermined process so as to maintain the polishing pad in a wet mode.