The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2000
Filed:
May. 13, 1998
Applicant:
Inventors:
Mike Goetsch, Phoenix, AZ (US);
Jim Siettmann, Gilbert, AZ (US);
Leo Craft, Chandler, AZ (US);
Eric Swanger, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29852 ; 29830 ; 29846 ; 174263 ; 174264 ; 257738 ; 216 18 ;
Abstract
A via for an electronic assembly. The assembly includes a substrate which has a via hole. The via hole is filled with a conductive material that extends across a diameter of the hole. The via hole can be filled by reflowing a solder ball that is attached to an outer surface of the substrate. The substrate may be part of a multi-layered integrated circuit package, wherein the vias couples internal routing layers with external contacts of the package. The filled vias can withstand extended thermal life cycles of the package.