The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2000
Filed:
Dec. 30, 1998
Ashok N Kabadi, Portland, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An electronic packaging assembly is disclosed. An electronic component is disposed on a socketing substrate utilizing a ball grid array or land grid array. The socketing substrate contains a series of pins that are embedded within the thickness of the socketing substrate. The pins correspond with the ball grid array or land grid array contacts of the electronic component. The socketing substrate is mounted onto a motherboard using an array of solder balls that correspond to and are disposed on, the end of the pins facing the motherboard. If desired, the electronic component may be protected by a metal lid. If desired, socketing substrates can be disposed on both sides of a motherboard.