The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2000
Filed:
Aug. 20, 1997
Shuji Eguchi, Toukai-mura, JP;
Yasuhide Sugawara, Hitachi, JP;
Toshiaki Ishii, Hitachi, JP;
Hiroyoshi Kokaku, Hitachi, JP;
Akira Nagai, Hitachi, JP;
Ryou Moteki, Hitachi, JP;
Ogino Masahiko, Hitachi, JP;
Masanori Segawa, Hitachi, JP;
Rie Hattori, Hitachinaka, JP;
Nobutake Tsuyuno, Hitachi, JP;
Takumi Ueno, Mito, JP;
Atsushi Nakamura, Fuchu, JP;
Asao Nishimura, Kokubunji, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A resin encapsulated semiconductor element is encapsulated with resin composition containing an organic compound selected from the group consisting of organobromine compounds, organophosphorus compounds and organonitrogen compounds, an inorganic filler, and a metal borate. The obtained resin encapsulated semiconductor element has the same flame resistance as a conventional semiconductor element which is encapsulated with a resin composition containing a halogen and antimony compound, and furthermore, has remarkably improved reliabilities regarding moisture resistance and storing at a high temperature by effects of the contained metal borate for suppressing generation of or trapping released gas components, such as halogen or phosphorus, and others.