The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2000

Filed:

Dec. 01, 1997
Applicant:
Inventors:

Russell Kaplan, Sunnyvale, CA (US);

Ralph Scherp, Cupertino, CA (US);

Assignee:

Electroglas, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438 14 ; 438 25 ; 438 16 ; 324758 ;
Abstract

An improved method and apparatus for automatically aligning a wafer prober to the bonding pads of a semiconductor device are provided. In one embodiment of one aspect of the invention, a pattern of contact electrodes is located using a low magnification image of a number of contact electrodes. A shape representative of a contact electrode point is then fitted to each of the number of contact electrodes using a high magnification image of the contact electrodes and a centroid of that fitted shape is determined. The position of the centroid is compared to the position of each of the number of pads, and the pads and contact electrodes are moved relative to each other to a position for contact between the pads and contact electrodes. Other aspects and other embodiments are also described.


Find Patent Forward Citations

Loading…