The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2000
Filed:
Jul. 16, 1999
Weining Li, Singapore, SG;
Lin Yung Tao, Singapore, SG;
Ramachandramurthy Pradeep Yelehanka, Singapore, SG;
Tin Tin Wee, Singapore, SG;
Chartered Semiconductor Manufacturing Company, Singapore, SG;
Abstract
A method of fabricating local interconnects of polycide has been achieved. A substrate is provided. Narrowly spaced features, such as MOS transistor gates and polysilicon traces, are provided overlying the substrate. A dielectric layer is deposited overlying the substrate and the narrowly spaced features. The dielectric layer is patterned to form openings between the narrowly spaced features for planned contacts to the surface of the substrate. A doped polysilicon layer is deposited overlying the dielectric layer and filling the openings. The doped polysilicon layer is etched down to the top surface of the narrowly spaced features. The doped polysilicon layer remains in the spaces between the narrowly spaced features. A polycide layer is formed overlying the narrowly spaced features and the doped polysilicon layer. The polycide layer and the doped polysilicon layer are patterned to complete the contacts and create the local interconnects of polycide, and the integrated circuit device is completed.