The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2000
Filed:
Jun. 30, 1998
Nikhil V Kelkar, Santa Clara, CA (US);
William J Schaefer, San Jose, CA (US);
John A Jackson, Sunnyvale, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
A chip-on-chip integrated circuit package is disclosed. The device includes a substrate having a plurality of conductive landings disposed on a first surface thereof, a first die that is positioned over a substrate, and a second die that is mounted on the first die. The first die has a plurality of I/O pads that face away from the substrate. The second die includes a first set of contacts that mate with the conductive landings on the substrate and a second set of contacts that mate with the I/O pads on the first die. In a preferred embodiment, the first set of contacts on the second die take the form of a first set of solder bumps, and the second set of contacts on the second die take the form of a second set of solder bumps. The device may also include a die attach material for attaching the first die to the substrate, wherein the die attach material and the first and second sets of solder bumps have a configuration that facilitates bonding and at least a portion of each of the solder bumps in the first and second sets of solder bumps and the die attach material have a substantially common reflow temperature. A method for making a chip-on-chip integrated circuit package is also disclosed.