The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2000
Filed:
Jun. 29, 1998
Applicant:
Inventors:
James P Letterman, Jr, Mesa, AZ (US);
Albert J Laninga, Tempe, AZ (US);
James H Knapp, Chandler, AZ (US);
Joseph K Fauty, Mesa, AZ (US);
William F Burghout, Mesa, AZ (US);
Assignee:
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01C / ; H01C / ; H01C / ;
U.S. Cl.
CPC ...
257730 ; 257690 ; 257684 ; 257692 ; 257676 ; 438123 ;
Abstract
An electronic component includes a substrate (301, 801), a leadframe (101, 601, 710) coupled to a first surface of the substrate (301, 801) and extending beyond the first surface and towards a second surface of the substrate (301, 801), and an electrically conductive layer coupled to the second surface and coplanar with a contact portion of the leadframe (101, 601, 710) where the leadframe (101, 601, 710) and the electrically conductive layer form a package around the substrate (301, 801).