The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2000
Filed:
May. 01, 1998
Fumio Miyajima, Nagano, JP;
Apic Yamada Corporation, Nagano, JP;
Abstract
A resin molding method by which resin is filled into a cavity while an article to be molded is clamped between upper and lower molding dies, wherein a cavity indentation is formed from an end face of a cavity piece provided in a cavity hole formed in the molding piece and of an internal wall surface of the cavity hole, the method including the steps of: arranging the cavity piece provided in the lower molding die so as to be movable in a direction in which the molding dies are opened or closed; covering a parting surface of each of the resin molding dies with a release film; sucking the release film from an area in the vicinity of an inner bottom surface of the cavity indentation of the lower molding die, to thus form a storage section for storing resin used for a molding operation within the cavity hole; feeding a required amount of resin to the storage section; setting the article on the lower molding die and clamping the article between the resin molding dies; and pressing the cavity piece of the lower molding die to a resin molding position to thus cause the resin provided in the cavity to set, thereby molding the article with resin.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile