The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2000
Filed:
Mar. 30, 1999
Vanguard International Semiconductor Corporation, Hsinchu, TW;
Abstract
A lead frame equipped with modified lead fingers which have inclined tip portions for achieving an improved wire bond is provided. The inclined tip portions on the lead fingers can be formed in a stamping process with an angle on a top surface of the inclined tip portion measured at smaller than 30.degree. from a horizontal plane of the lead finger. It is preferred that the inclined angle should be between about 5.degree. and about 30.degree., and more preferred that the angle should be between about 5.degree. and about 20.degree.. A wedge bond formed on the inclined tip portion of a lead finger has improved thickness and thermal stress endurance. The thermal stress endurance may be improved by at least 20% and preferably by at least 50% when tested in a thermal cycling test between 150.degree. C. and -65.degree. C.