The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2000
Filed:
Sep. 13, 1996
Hirokazu Tohya, Tokyo, JP;
Shiro Yoshida, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
There is provided a multi-layered printed wiring board including a power supply layer, a ground layer, a signal layer, and insulators sandwiched between those layers. The power supply layer is provided with a circuit in the form of wirings for imparting impedance thereto. For instance, the power supply layer may be formed to include main wirings for distributing a dc current entirely to the printed wiring board with a dc voltage drop being depressed, and branch wirings for enhancing high frequency impedance to isolate circuits in terms of high frequency, which circuits are mounted on the multi-layered printed wiring board and operated independently with each other. The invention makes it possible to provide a relatively great inductance to thereby decrease high frequency power supply current which is generated on IC/LSI operation and is to flow into decoupling capacitors. In addition, in accordance with the present invention, it is possible to identify a route through which a current runs into the power supply layer to thereby provide an optimal decoupling capacitor to every IC/LSI as a source of high frequency power supply current.