The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2000
Filed:
Feb. 09, 1998
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A semiconductor package includes a laminate of substrates having a cavity 16, through-holes 25 and circuit patterns, wherein the through-holes 45 and some of the circuit patterns 18 are coated with a plated nickel/gold coating 50. A method for producing the package comprises a step for producing a laminate by sandwiching circuit boards 20a, each having an opening 14 for the cavity and inner circuit patterns 18, with a pair of circuit boards 20b having no opening, a first plating step including first forming bores 44 for the through-holes and then applying a plated copper coating 48 to the inner wall of the through-hole or others, a step for forming outer circuit patterns on the circuit board 20b by the etching, and a step for opening the cavity 16 by providing an opening 60 in the circuit board 20b, and a second plating step for applying a plated nickel coating and a plated gold coating 50 to the inner circuit patterns 18 in the cavity 16, wherein a further step is interposed between the first plating process and the cavity-opening process, for applying a plated nickel coating 58 to the through-holes.