The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2000
Filed:
May. 21, 1997
Masahiko Kobayashi, Kanagawa, JP;
Anelva Corporation, Tokyo, JP;
Abstract
A sputtering apparatus which is used in a film depositing step in manufacturing a semiconductor integrated circuit or the like. In a vacuum vessel, a target and a substrate are disposed so as to be coaxial and parallel with and oppose each other, and a thin film is deposited on the inner face of a fine hole which is formed in the surface of the substrate. The target has a size Dt at which relationships that Q.sub.1 =N.multidot.Q.sub.2 and that N is not smaller than 0.7, and more preferably not smaller than 0.7 and not larger than 1.2 are established between an angle Q.sub.1 satisfying tan Q.sub.1 =(Dt-Ds)/2L, and an angle Q.sub.2 satisfying tan Q.sub.2 =A/B where A indicates a diameter of the opening of the fine hole, B indicates a depth of the hole, Ds indicates a size of the substrate, and L indicates a distance between the target and the substrate.