The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2000
Filed:
Jul. 09, 1998
Peter Jeffrey Brofman, Hopewell Junction, NY (US);
Balaram Ghosal, Fishkill, NY (US);
Raymond Alan Jackson, Fishkill, NY (US);
Kathleen Ann Lidestri, Hopewell Junction, NY (US);
Karl J Puttlitz, Sr, Wappingers Falls, NY (US);
William Edward Sablinski, Beacon, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic component having a socketable bump grid array comprising shaped-solder coated metallic spheres is provided by a method which comprises positioning solder coated metal spheres in an aligning device having a plurality of openings corresponding to the array, the openings being tapered preferably in the form of a truncated cone with the base of the cone being at the upper surface of the aligning device and having a diameter larger than the diameter of the solder coated metal sphere. The opening is configured so that a sphere positioned in the opening extends partially above the upper surface of the aligning device. The pads of the substrate are then contacted with the positioned spheres and, when the solder is reflowed, the solder forms a bond between the conductive layer on the substrate in contact with the solder-coated metal sphere and takes the shape of the aligning device and which maintains a solder coating on the whole surface of the metal sphere. An apparatus is also provided for making such a socketable bump grid array.