The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2000
Filed:
May. 14, 1998
Applicant:
Inventors:
Kuniyuki Takahashi, Musashimurayama, JP;
Hijiri Hayashi, Nakano-ku, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ; B23K / ; B23K / ; B23K / ;
U.S. Cl.
CPC ...
228-45 ; 228-8 ; 228102 ; 2281805 ;
Abstract
In a bonding method and apparatus, a bonding arm having a bonding tool at one end thereof is controlled to stop at a constant height position by a computer that incudes a memory containing positional deviation correction values which correct deviations at stopping positions of the bonding arm so that a bonding arm position controller is controlled by the positional deviation correction values.
Takahashi, Kuniyuki. (2000). Wire bonding apparatus and control method thereof (U.S. Patent No. 6070778). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6070778
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile