The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2000
Filed:
May. 12, 1997
Applicant:
Inventors:
Assignee:
Tokyo Seimitsu Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D / ;
U.S. Cl.
CPC ...
125 21 ; 125 1602 ;
Abstract
The moving direction of the wire line 15A at the cut portion 44 for cutting the columnar semiconductor ingot 18 corresponds to the vertical-downward direction. And, the semiconductor ingot 18 supported with the cut-feed means 20 is fed horizontally so as to be pushed in perpendicular to said wire line 15A, and the processing liquid 42 is supplied to the wire line 15A from the grind liquid supply nozzle 40 placed at the upper side of the cut portion 44. Therefore, the processing liquid 42 supplied to the wire line 15A flows along the wire line 15A, so that the processing liquid 42 can be surely supplied to the cut portion 44.