The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2000
Filed:
Jan. 20, 1998
Hiroshi Oishi, Annaka, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Abstract
There is disclosed a method of slicing a workpiece through use of a wire saw. The workpiece is pressed at a predetermined feed rate against a wire which moves from a wire feed side to a wire take-up side and slices the workpiece into wafers while abrasive grain slurry is fed to the press contact portion between the wire and the workpiece. The feed rate of the workpiece is controlled according to the size of abrasive grains in the abrasive grain slurry, such that a decrease in the slicing stock removal stemming from a decrease in the size of abrasive grains during slicing is compensated with an increase in the slicing stock removal effected by decreasing the feed rate of the workpiece. The method can make the thicknesses of sliced wafers uniform to the extent possible.