The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2000
Filed:
Apr. 27, 1998
Applicant:
Inventor:
Misuzu Machii, Nagano, JP;
Assignee:
Shinko Electric Industries, Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257730 ; 757729 ;
Abstract
A resin sealing ceramic package 10 for resin sealing of a semiconductor element 14 mounted in a cavity 16, the ceramic package having a bleed-out-preventing metal pattern 24, to prevent bleed-out of a sealing resin filled in the cavity 16 from out of the cavity, which comprises a metallized layer 26 made of tungsten formed in a frame-shape on the surface of the ceramic package 10 along the edges of the cavity 16, and a metal plating layer 32 consisting of a nickel layer 28 of at least 1.5 .mu.m thickness and a gold layer 30 of at least 0.3 .mu.m thickness formed on the metallized layer 26.