The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2000
Filed:
Mar. 27, 1998
Jin Amanokura, Hitachi, JP;
Fumihiko Ota, Hitachi, JP;
Ritsuko Obata, Hitachi, JP;
Toshihiko Akahori, Hitachi, JP;
Kenji Suzuki, Hitachi, JP;
Hiroshi Nishizawa, Kitaibaraki, JP;
Katsunori Tsuchiya, Hitachi, JP;
Takao Hirayama, Ibaraki-ken, JP;
Hiroaki Hirakura, Ibaraki-ken, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A photosensitive resin composition comprising (A) a resin having an amide bond, an oxyalkylene group and a carboxyl group, (B) a photopolymerizable compound having an ethylenically unsaturated group and (C) a photopolymerization initiator has an alkali developability, good sensitivity and photocurability, an efficient pattern formability by photolithography, a good application workability to a film and is capable of producing cured products having good folding endurance, solder reflow heat resistance, solvent resistance, bondability and nonflammability and suitable for producing a photosensitive element, a photosensitive laminate and a flexible printed circuit board.