The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2000
Filed:
Mar. 06, 1995
Jan Visser, Eindhoven, NL;
U.S. Philips Corporation, New York, NY (US);
Abstract
Method is described of reducing particle contamination during sputtering and sputtering device for the implementation of such a method. A method of providing a layer on a substrate (1), whereby, during a certain process time, material (8) is detached from a target plate (6) through a bombardment of this target plate with ions from a gas discharge (4) under reduced pressure in a reactor chamber (2) which is provided with a support (7) for the substrate (1). Measures are taken to ensure that material deposited on a surface of chamber component (9) near the support (7) has a better adhesion. According to the invention, the measure for achieving a better adhesion of the material consists in that the surface of the chamber component (9) is first bombarded with ions from the gas discharge (4) for at least part of the process time. Material (8) detached from the target plate (6) and hitting the chamber component (9) will have a good adhesion thanks to the ion bombardment, so that no loose particles from the surface of the chamber component (9) can contaminate the layer on the substrate (1).