The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 09, 2000
Filed:
Jun. 24, 1998
Lisa J Jimarez, Newark Valley, NY (US);
Craig G Heim, Kirkwood, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Method and apparatus removing a component having a solder ball grid array to a circuitized substrate. The solder balls have a first temperature at which they melt. The component has a second temperature, greater than the first temperature, over which the component is damaged. The method has a step of placing a thermal shield over the component. In a next step, the circuitized substrate and the component having the solder ball grid array are heated to a third temperature lower than the first temperature. In a next step, a stream of hot gas of a fourth temperature is directed for a predetermined time about the periphery of the thermal shield such that the solder balls reach the first temperature thereby reflowing the solder joints or balls, while other parts of the component reach less than the second temperature. At this point, the component is either attached to the circuitized substrate or permitted to be removed therefrom. Similar methods are also provided for attaching a component having a solder ball grid array from a circuitized substrate.