The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2000
Filed:
Mar. 05, 1998
Applicant:
Inventors:
Tzong-Liang Chen, Hsinchu, TW;
Kuan-Ting Chen, Hsinchu, TW;
Chih-Ming Chen, Tainan Hsien, TW;
Hao-Chien Yung, Hsinchu, TW;
Assignee:
Windbond Electronics Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438381 ; 438238 ; 438393 ; 438411 ; 438421 ; 438619 ; 257531 ; 336165 ;
Abstract
A method for manufacturing an inductor with resonant frequency and Q value increased in semiconductor process can reduce substrate coupling effect, because (an) air layer(s) is/are formed just under a spiral metal layer which functions as an inductor. In addition, part of the substrate material still remains around the air layer(s), which can be used as a support for the spiral metal layer. Therefore, a problem causing the above-mentioned spiral metal layer to collapse will never occur.