The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 25, 2000
Filed:
Dec. 12, 1997
Vernon Solberg, Saratoga, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A method of making a multichip package includes providing a flexible substrate having a plurality of conductive traces and flexible leads connected to outer ends of the conductive traces adjacent the periphery of said flexible substrate. The flexible substrate includes conductive terminals accessible at a surface thereof connected to at least some of the conductive traces. The method includes providing a first microelectronic element having a front face including contacts and a back surface and assembling the front face thereof with the flexible substrate; depositing a compliant element over the back surface of the first microelectronic element; providing a second microelectronic element having a front face including contacts and assembling the front face thereof with the compliant element so that the second microelectronic element overlies the first microelectronic element; and electrically interconnecting the first and second microelectronic elements with one another and with the conductive terminals by connecting the flexible leads to the second microelectronic element and connecting at least some of the traces to the first microelectronic element.