The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2000
Filed:
Aug. 05, 1997
Alexander Rieger, Kirchdorf, DE;
Simon Ehrenschwendtner, Winhoring, DE;
Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG, Burghausen, DE;
Abstract
In a process for the material-abrading machining of the edge of a semiconductor wafer, the semiconductor wafer is resting on a rotationally movable table, is rotated about a central axis and is machined by a plurality of rotating machining tools. It is intended for each of the machining tools to abrade a specific quantity of material from the edge of the semiconductor wafer. The process is one in which the machining tools, during the course of a 360.degree.-rotation of the semiconductor wafer, are successively advanced toward the edge of the semiconductor wafer and ultimately simultaneously machine the edge of the semiconductor wafer. A machining tool which has just been advanced is intended to abrade a smaller quantity from the edge of the semiconductor wafer than a previously advanced machining tool. The machining of the edge of the semiconductor wafer with one machining tool is terminated at the earliest once the semiconductor wafer has rotated through 360.degree., calculated from the advancement of this machining tool.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile