The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2000

Filed:

Dec. 07, 1998
Applicant:
Inventors:

Yoshihisa Matsubara, Tokyo, JP;

Masato Kawata, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
257315 ; 257382 ; 257384 ; 438201 ; 438211 ; 438275 ; 438655 ; 438682 ; 438257 ;
Abstract

A semiconductor device is provided, which makes it possible to decrease the electric sheet resistance of source/drain regions of MOSFETs in a peripheral circuitry without degradation of the data writing speed in nonvolatile memory cells. This device is comprised of nonvolatile memory cells and a peripheral circuitry provided on a same semiconductor substrate. The nonvolatile memory cells are formed by a first plurality of MOSFETs of a first conductivity type. The peripheral circuitry includes a second plurality of MOSFETs of the first conductivity type. Each of the first plurality of MOSFETs is equipped with a gate electrode having a floating gate for data storing and source/drain regions having substantially no silicide films. Each of the second plurality of MOSFETs is equipped with source/drain regions having silicide films and a doping concentration lower than that of the source/drain regions of each of the first plurality of MOSFETs. It is preferred that the doping concentration of the source/drain regions of the first plurality of MOSFETs is equal to 1.times.10.sup.19 atoms/cm.sup.3 or higher and the doping concentration of the source/drain regions of the second plurality of MOSFETs is lower than 1.times.10.sup.19 atoms/cm.sup.3.


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