The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2000
Filed:
Mar. 05, 1998
Applicant:
Inventors:
Kuniyuki Takahashi, Musashimurayama, JP;
Minoru Torihata, Musashimurayama, JP;
Kazumasa Kimura, Nishitama-gun, JP;
Tatsunari Mii, Musashimurayama, JP;
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ; B23K / ; B23K / ; B23K / ;
U.S. Cl.
CPC ...
2281805 ; 228-45 ; 228102 ; 228213 ;
Abstract
A wire bonding method for bonding a first bonding point and then a second bonding point by bonding wire that passes through a capillary including a reverse operation that moves the capillary in a direction opposite from a second bonding point after the bonding is done to the first bonding point, a damper is closed temporarily during the reverse operation so as to apply tension to the wire, thus forming a strong kink at an uppermost point of the neck height portion of a resulting wire loop between the first and second bonding points.