The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 14, 2000

Filed:

Jul. 10, 1997
Applicant:
Inventors:

Andreas C Pfahnl, Londonderry, NH (US);

Alexander H Slocum, Bow, NH (US);

John H Lienhard, V, Lexington, MA (US);

Assignee:

Teradyne, Inc., Boston, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D / ;
U.S. Cl.
CPC ...
206725 ; 206714 ; 220507 ;
Abstract

Convective heat transfer enhancement features are formed in trays for carrying and thermally conditioning semiconductor devices or on integrated circuit chip packages. Upward extending ribs, perpendicular to a fluid flow, are formed in the trays and/or packages for increasing the mixing of the fluid flow near the devices under test, thereby enhancing convective heat transfer to or from the devices. Downward extending ribs are also formed in the trays and/or packages. The upward and downward extending ribs formed in the trays are in a staggered relationship for facilitating the stacking of trays. Alternatively, a surface roughness is applied to the trays and/or packages. The surface roughness applied to the packages is such that sufficient smooth regions remain on the packages for allowing pick-and-place machines to handle the packages.


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