The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 29, 2000
Filed:
Jun. 11, 1998
Takayuki Noto, Higashimurayama, JP;
Eiji Oi, Kawagoe, JP;
Yahiro Shiotsuki, Hiratsuka, JP;
Kazuo Kato, Kitamoto, JP;
Hideki Ohagi, Nakakoma-gun, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In a CMOS gate array, each of bonding pads corresponding to input cells for signals and bonding pads corresponding to input cells for supply voltages is formed of a plurality of conductor layers, whereas each of bonding pads (non-connected pads) corresponding to input/output cells not to be used is formed of, for example, the uppermost conductor layer. Thus, the bonding pad (non-connected pad) corresponding to the input/output cell not to be used becomes greater in the thickness of an underlying insulator film and longer in its spacing from a semiconductor substrate in comparison with each of the bonding pad for the signal and the bonding pad for the supply voltage.