The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 29, 2000
Filed:
May. 02, 1997
John A Dunlop, Phoenix, AZ (US);
Michael Goldstein, Sunnyvale, CA (US);
Gerald B Feldewerth, Phoenix, AZ (US);
Cari Shim, Sunnyvale, CA (US);
Stephan Schittny, Phoenix, AZ (US);
Sony Corporation, Tokyo, JP;
Materials Research Corporation, Orangeburg, NY (US);
Abstract
A target for sputtering is subjected to a surface treatment process and special packaging after target manufacture for improved sputtering performance and process and yield by reducing particulates. The sputtering target is first surface treated to remove oxides, impurities and contaminants. The surface treated target is then covered with a metallic enclosure and, optionally, a passivating barrier layer. The metallic enclosure protects the target surface from direct contact with subsequently employed packaging material such as plastic bags, thereby eliminating sources of organic materials during sputtering operations. The surface treatment of the target removes deformed material, smearing, twins, or burrs and the like from the target surface, reducing 'burn-in' or sputter conditioning time prior to production sputtering of thin films.