The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2000
Filed:
Dec. 17, 1997
Applicant:
Inventors:
Taylor R Efland, Richardson, TX (US);
Quang X Mai, Sugarland, TX (US);
Charles E Williams, Dallas, TX (US);
Stephen A Keller, Sugarland, TX (US);
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438722 ; 438722 ;
Abstract
A thick plated interconnect (80) may be fabricated by forming a metal layer (20) above a semiconductor layer (12). A dielectric layer (22) may be formed on the metal layer (20). A via (24) may be formed in the dielectric layer (22) to expose the metal layer (20). A copper lead (50) may be formed electrically coupled to the metal layer (20) through the via (24) of the dielectric layer (22). A barrier member (88) may be formed on the copper lead (50). A bondable member (86) comprising aluminum may be formed on the barrier member (88).